UHP N₂ 99.9995%+ (5N5) for wafer fabrication, oxidation, diffusion, and cleanroom inerting. PPB-level purification with full particle monitoring and SCADA integration.
Point-of-use purification to 99.9999%+ (6N). Particle count <1 particle/cf at 0.003 µm. Critical for sub-7nm node wafer processing.
Online O₂ (ppb-level), moisture, and particle monitoring with automatic alarm. Fully integrated with fab SCADA/GEM300 systems.
On-site UHP N₂ generation reduces gas cost vs. delivered liquid N₂ by 40–60%. Lower operating cost per wafer pass.
Dual-train N₂ generation with automatic failover. Redundant purification skids. Buffer storage for uninterrupted supply during maintenance.
PSA at 99.99%+
Remove O₂ to <1 ppb
0.003 µm point-of-use
Electropolished SS piping
Continuous ppb/O₂/particle
| Parameter | Value |
|---|---|
| N₂ Purity | 99.9995% – 99.9999% |
| O₂ Residual | <1 ppb |
| Particles | <1/cf at 0.003 µm |
| Dew Point | <−80°C |
| Hydrocarbons | <0.1 ppm |
| Monitoring | Online, 24/7, SCADA |
Diffusion, CVD, PVD, ion implantation. UHP N₂ blanket throughout.
Reflow soldering atmosphere. Prevents oxidation on PCB pads.
N₂ purge for load locks, transfer chambers, equipment enclosures.